BE Semiconductor Industries, commonly known as Besi, gives the Netherlands exposure to a part of the semiconductor stack that has become much more strategically important: assembly and advanced packaging.
As AI accelerators combine large logic dies, high-bandwidth memory and chiplet architectures, the way components are bonded and packaged can affect performance, power efficiency and yield.
Packaging is moving closer to the centre of chip performance
For decades, packaging was often treated as a lower-value back-end step after wafer fabrication. That distinction is becoming less useful as advanced systems depend on extremely dense interconnects between logic and memory.
Hybrid bonding and other advanced assembly technologies therefore sit closer to the core performance roadmap than traditional packaging did.
A complementary Dutch equipment position
Besi's role complements ASML's lithography and ASM International's deposition technologies. Together they show how Dutch companies participate across several bottlenecks in semiconductor manufacturing rather than one isolated tool category.
That diversity is one reason DBR is building the semiconductor cluster company by company, with each firm's value-chain role kept explicit.